Heat dissipation components
We can provide a wide range of proposals tailored to your needs.
【Product Lineup】 Heat Sink Heat Pipe Thermal Conductive Sheet Peltier Element
- Company：オリナス 東京営業所、名古屋営業所、京都営業所、大阪営業所、香港
- Price：Other
Heat Dissipation Module - List of Manufacturers, Suppliers, Companies and Products | IPROS GMS
Heat Dissipation Module Product List
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![[DONGYANG PISTON] Enclosure and others](https://image.mono.ipros.com/public/product/image/df8/2001513335/IPROS6702130875203215217.png?w=280&h=280)
[DONGYANG PISTON] Enclosure and others
Inclosure/Manifold (FCV) and others
Enclosure/Manifold - Joining of dissimilar materials (aluminum, plastic) Heat dissipation module - Design capability for maximizing cooling efficiency
- Company：KOTRA名古屋 韓国貿易センター（名古屋）
- Price：Other
Hybrid of metal and carbon for electronic devices.
Enhancing the heat dissipation of electronic devices through the fusion of metal and carbon.
In the field of electronic devices, the efficient dissipation of heat generated by increased performance is considered crucial for the stable operation and longevity of products. This is particularly challenging in compact devices, where heat dissipation design must be addressed within limited space. Insufficient heat dissipation can lead to performance degradation or failure due to overheating of components. Our hybrid materials, combining metal's thermal conductivity with carbon's lightweight and high rigidity, contribute to improved heat dissipation. 【Application Scenarios】 - Heat dissipation components for electronic device enclosures - Cooling mechanism components such as CPU coolers - Heat dissipation materials for high-power devices 【Benefits of Implementation】 - Suppression of temperature rise inside devices - Improved reliability of components - Contribution to miniaturization and lightweight design of products
- Company：株式会社がまかつ
- Price：Other
